DWL 66⁺激光光刻机系统是具经济效益的高分辨率图像产生器，适用于小批量掩模板制作和直写需求。该系统的功能和灵活性使其成为Life Science, Advanced Packaging, MEMS, Micro-Optics, Semiconductor以及所有其他需要微结构应用的刻研工具。DWL 66⁺的客户群包括全球200多所顶尖大学和研究机构，许多系统功能是与这些机构合作开发，及先进技术不断改进以增加高分办率：DWL 66⁺的最小结构尺寸为300 nm，提供了极高的分辨率，优于或等于研发领域中最强大的光学光刻系统。

基本的DWL 66⁺包含创造和分析微结构所需的所有功能。它可以用于掩模板制作或直写在任何涂有光刻胶的平坦材料上，多样化选择可提高灵活性，使系统适用于更多应用领域。

The DWL 66⁺ laser lithography system is an economical, high-resolution pattern generator for direct writing. The system features powerful options such as front- and backside alignment and a choice of 405 nm or 375 nm laser wavelength. Further advanced options include an absolute position calibration and an automatic loading system. A total of six different Write Modes are available, amongst them the High-Resolution Mode with a resolution of 300 nm. Notably, the DWL 66⁺ presents the ultimate performance in Grayscale exposure mode, from Standard to Professional levels: This versatile technique for the creation of complex 2.5D microstructures in thick layers of low-contrast positive photoresists is used for applications such as micro-lenses, DOEs, holograms (CGHs), and textured surfaces.

This highly flexible and customizable system can be specifically tailored to your application – the sophisticated capabilities of the DWL 66⁺ make it the essential lithography research tool in Life Science, Advanced Packaging, MEMS, Micro-Optics, Semiconductor and all other applications that require microstructures.

DWL2000和DWL4000激光光刻系统为快速、灵活的高分辨率图形产生器，用于制作光罩和直写。这些系统的写入面积高达200x200mm²与400x400mm²，是MEMS、BioMEMS、Micro Optics、ASICs、Micro Fluidics、Sensors，CGH以及所有其他微结构应用里，需快速构图于光罩和硅片的完美方案。

除了高分辨率的2D图形之外，还提供灰度光刻曝光模式，可在厚光刻胶中创建复杂的3D结构。与其他技术相较，此光刻技术能够在大面积中产出3D微结构。优化评估灰度曝光的特殊软件工具，减少新图像设计的循环时间。为了确保最低的表面粗糙度和形状一致性，该系统支持高达4096灰度级，在业界中具备无与伦比的性能。常见的应用包括部份大型的跨国公司制造用于电信或照明产业的晶圆级光学器件，其他新应用包括显微镜制造以及生物学和生命科学领域的器件制造。

The DWL 2000 and 4000 laser lithography systems constitute fast, flexible high-resolution pattern generators, capable of the Professional performance level of Grayscale Lithography. The latter allows the creation of complex 2.5D structures in thick photoresist over large areas. Most common applications of the Grayscale exposure mode include the fabrication of wafer level optics used for telecommunication or illumination market segments; it is also used in display manufacturing, and in device fabrication in Biology and the Life Sciences.

In addition to Grayscale, the DWL series tools excel at binary 2D exposures, down to the highest resolution with a minimum feature size of 500 nm. With a write area of up to 400 mm x 400 mm and the optional automatic loading system, these systems provide the perfect solution if you require high-throughput patterning of masks and wafers in MEMS, BioMEMS, Micro Optics, ASICs, Micro Fluidics, Sensors, and CGHs.